{"id":886579,"date":"2026-01-20T19:24:22","date_gmt":"2026-01-21T01:24:22","guid":{"rendered":"https:\/\/newsycanuse.com\/index.php\/2026\/01\/20\/the-top-8-semiconductor-stories-of-2025\/"},"modified":"2026-01-20T19:24:22","modified_gmt":"2026-01-21T01:24:22","slug":"the-top-8-semiconductor-stories-of-2025","status":"publish","type":"post","link":"https:\/\/newsycanuse.com\/index.php\/2026\/01\/20\/the-top-8-semiconductor-stories-of-2025\/","title":{"rendered":"The Top 8 Semiconductor Stories of 2025"},"content":{"rendered":"<div data-headline=\"The Top 8 Semiconductor Stories of 2025\">\n<p><span>This year\u2019s top semiconductor stories were mostly about the long and twisting trips a technology takes from idea (or even raw material) to commercial deployment. I\u2019ve been at <em>IEEE Spectrum<\/em> long enough to have seen some of the early days of things that became commercial only this year.<\/span><\/p>\n<p>In chipmaking, that includes the production of the next evolution of transistor design\u2014<a href=\"https:\/\/spectrum.ieee.org\/the-nanosheet-transistor-is-the-next-and-maybe-last-step-in-moores-law\" target=\"_blank\">nanosheet transistors<\/a>\u2014and the arrival of <a href=\"https:\/\/spectrum.ieee.org\/tag\/nanoimprint-lithography\">nanoimprint lithography<\/a>. In <a href=\"https:\/\/spectrum.ieee.org\/tag\/optoelectronics\">optoelectronics<\/a>, it was the commercialization of <a href=\"https:\/\/spectrum.ieee.org\/tag\/optical-fiber\">optical fiber<\/a> links that go directly into the processor package.<\/p>\n<p>Of course there were also great new technologies recently born, like growing diamond inside ICs to cool them. But there were also, unfortunately, developments that are getting in the way of moving technologies from the laboratory to the semiconductor fab.<\/p>\n<p>Still, if anything, the year\u2019s best semiconductor stories showed that technology is full of fascinating tales.<\/p>\n<h2>1. <a href=\"https:\/\/spectrum.ieee.org\/diamond-thermal-conductivity\" target=\"_self\">Diamond Blankets Will Keep Future Chips Cool<\/a><\/h2>\n<p data-rm-resized-container=\"25%\"> <img loading=\"lazy\" decoding=\"async\" alt=\"Blue glowing microchip with pixelated data burst amid rising steam.\" data-rm-shortcode-id=\"0363dbc63b0a9af236a61dc716da5146\" data-rm-shortcode-name=\"rebelmouse-image\" src=\"https:\/\/spectrum.ieee.org\/media-library\/blue-glowing-microchip-with-pixelated-data-burst-amid-rising-steam.png?id=61766396&#038;width=2000&#038;height=1500&#038;quality=85&#038;coordinates=0%2C907%2C0%2C580\" height=\"1500\" id=\"5e9a4\" lazy-loadable=\"true\" width=\"2000\"> <small placeholder=\"Add Photo Credit...\">            Peter Crowther        <\/small><\/p>\n<p>It seems one of our readers\u2019 favorite things was this cool idea. Perhaps you read it while chilling out with a print copy of <em><em>Spectrum<\/em><\/em> or maybe while on your phone and icing a sore knee. (Okay, I\u2019ll stop.) <a href=\"https:\/\/spectrum.ieee.org\/tag\/stanford\">Stanford<\/a> professor <a href=\"https:\/\/profiles.stanford.edu\/srabanti-chowdhury\" target=\"_blank\">Srabanti Chowdhury<\/a> explained how her team has come up with a way <a href=\"https:\/\/spectrum.ieee.org\/diamond-thermal-conductivity\" target=\"_blank\">to grow diamonds inside ICs<\/a>, mere nanometers from heat-generating <a href=\"https:\/\/spectrum.ieee.org\/tag\/transistors\">transistors<\/a>. The result was radio devices that were more than 50 degrees Celsius cooler, and a pathway to integrate the highly heat-conductive material in <a href=\"https:\/\/spectrum.ieee.org\/tag\/3d-integration\">3D chips<\/a>. The article was part of a <a href=\"https:\/\/spectrum.ieee.org\/special-reports\/keeping-chips-cool\/\" target=\"_self\">special report <\/a>on the problem of heat in computing that includes an article on cooling chips with <a href=\"https:\/\/spectrum.ieee.org\/tag\/lasers\">lasers<\/a> and other great reads.<\/p>\n<h2>2. <a href=\"https:\/\/spectrum.ieee.org\/euv-light-source\" target=\"_self\">The Tiny Star Explosions Powering Moore\u2019s Law<\/a><\/h2>\n<p data-rm-resized-container=\"25%\"> <img loading=\"lazy\" decoding=\"async\" alt=\"A cloudy red partial ring in a field of stars (left). A red sphere on a field of black (right). \" data-rm-shortcode-id=\"26439cd738b6242940ee34ade6cffe74\" data-rm-shortcode-name=\"rebelmouse-image\" src=\"https:\/\/spectrum.ieee.org\/media-library\/a-cloudy-red-partial-ring-in-a-field-of-stars-left-a-red-sphere-on-a-field-of-black-right.jpg?id=56635642&#038;width=2000&#038;height=1500&#038;quality=85&#038;coordinates=0%2C573%2C0%2C510\" height=\"1500\" id=\"aa04b\" lazy-loadable=\"true\" width=\"2000\"> <small placeholder=\"Add Photo Credit...\">            Left: Stefan Ziegenbalg; Right: <a href=\"https:\/\/spectrum.ieee.org\/tag\/asml\">ASML<\/a> <\/small><\/p>\n<p>This one had a little bit of everything. It\u2019s the story of how <a href=\"https:\/\/www.asml.com\/en\" target=\"_blank\">ASML<\/a> figured out a key unknown in the development of <a href=\"https:\/\/spectrum.ieee.org\/euv-light-source\" target=\"_blank\">one of the most crucial (and craziest) contraptions in technology today<\/a>, the light source for <a href=\"https:\/\/spectrum.ieee.org\/tag\/extreme-ultraviolet\">extreme ultraviolet<\/a> <a href=\"https:\/\/spectrum.ieee.org\/tag\/lithography\">lithography<\/a>. But it\u2019s also a sweet story of a man and his grandfather\u2014but with supernovas, atomic bomb blasts, high-powered lasers, and a cameo by computer pioneer John von Neumann.<\/p>\n<h2>3. <a href=\"https:\/\/spectrum.ieee.org\/2d-semiconductors-molybdenum-disulfide\" target=\"_self\">Latest 2D Chip: 6,000 Transistors, 3 Atoms Thick<\/a><\/h2>\n<p data-rm-resized-container=\"25%\"> <img loading=\"lazy\" decoding=\"async\" alt=\"Zoomed-in optical microscope image showing a single die consisting of 5,900 molybdenum disulfide transistors, with input and output pads placed around the periphery.\" data-rm-shortcode-id=\"7f9a967243f730591b8c449bf70d9477\" data-rm-shortcode-name=\"rebelmouse-image\" src=\"https:\/\/spectrum.ieee.org\/media-library\/zoomed-in-optical-microscope-image-showing-a-single-die-consisting-of-5900-molybdenum-disulfide-transistors-with-input-and-out.jpg?id=59907664&#038;width=980\" height=\"1859\" id=\"cb5ab\" lazy-loadable=\"true\" width=\"2974\"> <small placeholder=\"Add Photo Credit...\">            Mingrui Ao, Xiucheng Zhou et al.        <\/small><\/p>\n<p>In past years, we\u2019ve reported plenty about <a href=\"https:\/\/spectrum.ieee.org\/cdimensions-2d-semiconductors\" target=\"_blank\">advances in making individual 2D transistors work well<\/a>. But in April we delivered a story of <a href=\"https:\/\/spectrum.ieee.org\/2d-semiconductors-molybdenum-disulfide\" target=\"_blank\">some 2D semiconductor integration heroics<\/a>. Researchers in <a href=\"https:\/\/spectrum.ieee.org\/tag\/china\">China<\/a> managed to integrate nearly 6,000 <a href=\"https:\/\/spectrum.ieee.org\/tag\/molybdenum-disulfide\">molybdenum disulfide<\/a> devices to make a <a href=\"https:\/\/spectrum.ieee.org\/tag\/risc-v\">RISC-V<\/a> processor. Amazingly, despite using just laboratory-level manufacturing, the chip\u2019s creators achieve a 99.7 percent yield of good transistors.<\/p>\n<h2>4. <a href=\"https:\/\/spectrum.ieee.org\/nanoimprint-lithography\" target=\"_self\">Nanoimprint Lithography Aims to Take on EUV<\/a><\/h2>\n<p data-rm-resized-container=\"25%\"> <img loading=\"lazy\" decoding=\"async\" alt=\"A masked worker standing in front of a large floor-to-ceiling manufacturing system.\" data-rm-shortcode-id=\"98eb2737a18bdb3da039bdea5575bb5a\" data-rm-shortcode-name=\"rebelmouse-image\" src=\"https:\/\/spectrum.ieee.org\/media-library\/a-masked-worker-standing-in-front-of-a-large-floor-to-ceiling-manufacturing-system.jpg?id=54970109&#038;width=980\" height=\"1159\" id=\"2dd66\" lazy-loadable=\"true\" width=\"1738\"> <small placeholder=\"Add Photo Credit...\"> <a href=\"https:\/\/spectrum.ieee.org\/tag\/canon\">Canon<\/a> <\/small><\/p>\n<p>Our <a href=\"https:\/\/spectrum.ieee.org\/tag\/japan\">Japan<\/a> correspondent, John Boyd, described <a href=\"https:\/\/spectrum.ieee.org\/nanoimprint-lithography\" target=\"_blank\">an exciting potential competitor to EUV lithography<\/a>. Canon announced that it had sold the first nanoimprint lithography system for chipmaking. Instead of carrying the chip\u2019s features as a pattern of light, this machine literally stamps them onto the silicon. It\u2019s a technology that\u2019s been <a href=\"https:\/\/spectrum.ieee.org\/nanotransistors-stamped-out\" target=\"_self\">decades in the making<\/a>. In fact, one of my first reporting trips for <em><em>IEEE Spectrum<\/em><\/em> was to visit a startup using nanoimprint lithography to make specialized <a href=\"https:\/\/spectrum.ieee.org\/tag\/optics\">optics<\/a>. I got in a minor car accident on my way there and never got to see the tech in person. But if you want a look, there\u2019s<a href=\"https:\/\/global.canon\/en\/news\/2024\/20240926.html\" target=\"_blank\"> one in Austin, Texas<\/a>.<\/p>\n<h2>5. <a href=\"https:\/\/spectrum.ieee.org\/natcast-layoffs\" target=\"_self\">Natcast to Lay Off Majority of Its Staff<\/a><\/h2>\n<p data-rm-resized-container=\"25%\"> <img loading=\"lazy\" decoding=\"async\" alt=\"An illustration of the logo for Natcast, which resembles an American flag with components related to chips, falling apart. \" data-rm-shortcode-id=\"f49f80cc1ded1a44ea76005a0162690b\" data-rm-shortcode-name=\"rebelmouse-image\" src=\"https:\/\/spectrum.ieee.org\/media-library\/an-illustration-of-the-logo-for-natcast-which-resembles-an-american-flag-with-components-related-to-chips-falling-apart.jpg?id=61557640&#038;width=980\" height=\"2500\" id=\"474d2\" lazy-loadable=\"true\" width=\"4000\"> <small placeholder=\"Add Photo Credit...\">IEEE Spectrum; Source image: Natcast        <\/small><\/p>\n<p>The U.S. CHIPS and Science Act promised to be transformational\u2014not just for <a href=\"https:\/\/spectrum.ieee.org\/tag\/chip-manufacturing\">chip manufacturing<\/a> but for providing R&#038;D and infrastructure that would help close the <a href=\"https:\/\/www.rdworldonline.com\/bridging-the-lab-to-fab-gap-accelerates-semiconductor-innovation-and-commercialization\/\" target=\"_blank\">dreaded lab-to-fab gap<\/a> that captures and kills so many interesting ideas. The main vehicle for that R&#038;D and infrastructure was the National Semiconductor Technology Center, a legally mandated, US $7.4 billion program to be administered by a public-private partnership. <a href=\"https:\/\/spectrum.ieee.org\/natcast-layoffs\" target=\"_blank\">But the Commerce Department ended the latter entity<\/a>, called Natcast, in late summer. The vitriol with which it was done shocked many chip experts. Now Commerce has killed another <a href=\"https:\/\/spectrum.ieee.org\/tag\/chips-act\">CHIPS Act<\/a> center, <a href=\"https:\/\/spectrum.ieee.org\/semiconductor-digital-twins-funding\" target=\"_self\">the SMART USA Institute<\/a>, which was dedicated to <a href=\"https:\/\/spectrum.ieee.org\/tag\/digital-twins\">digital twins<\/a> for chip manufacturing.<\/p>\n<h2>6. <a href=\"https:\/\/spectrum.ieee.org\/co-packaged-optics\" target=\"_self\">A Crucial Optical Technology Has Finally Arrived<\/a> <\/h2>\n<p data-rm-resized-container=\"25%\"> <img loading=\"lazy\" decoding=\"async\" alt=\"Nvidia GPUs on a black background.\" data-rm-shortcode-id=\"77339334b5f138b3f2c282f648fc5838\" data-rm-shortcode-name=\"rebelmouse-image\" src=\"https:\/\/spectrum.ieee.org\/media-library\/nvidia-gpus-on-a-black-background.jpg?id=58558428&#038;width=980\" height=\"1283\" id=\"1891e\" lazy-loadable=\"true\" width=\"2053\"> <small placeholder=\"Add Photo Credit...\"> <a href=\"https:\/\/spectrum.ieee.org\/tag\/nvidia\">Nvidia<\/a> <\/small><\/p>\n<p>The idea of bringing speedy, <a href=\"https:\/\/spectrum.ieee.org\/tag\/low-power\">low-power<\/a> <a href=\"https:\/\/spectrum.ieee.org\/tag\/optical-interconnects\">optical interconnects<\/a> all the way to the processor has <a href=\"https:\/\/spectrum.ieee.org\/optical-interconnects\" target=\"_blank\">fired the imagination of engineers<\/a> for years. But high cost, low reliability, and serious engineering issues have kept it from happening. This year we saw <a href=\"https:\/\/spectrum.ieee.org\/co-packaged-optics\" target=\"_blank\">the first hint that it was really coming<\/a>. <a href=\"https:\/\/spectrum.ieee.org\/tag\/broadcom\">Broadcom<\/a> and Nvidia\u2014separately\u2014developed optical <a href=\"https:\/\/spectrum.ieee.org\/tag\/transceivers\">transceivers<\/a> integrated in the same package as network switch chips, which sling data from server rack to server rack inside <a href=\"https:\/\/spectrum.ieee.org\/tag\/data-centers\">data centers<\/a>.<\/p>\n<h2>7. <a href=\"https:\/\/spectrum.ieee.org\/sram-intel-tsmc\" target=\"_self\">Intel, Synopsys, TSMC All Unveil Record Memory Densities<\/a><\/h2>\n<p data-rm-resized-container=\"25%\"> <img loading=\"lazy\" decoding=\"async\" alt=\"Golden lines on a black background reminiscent of a circuit diagram.\" data-rm-shortcode-id=\"fedd0851e29b806527d3869a0a90d446\" data-rm-shortcode-name=\"rebelmouse-image\" src=\"https:\/\/spectrum.ieee.org\/media-library\/golden-lines-on-a-black-background-reminiscent-of-a-circuit-diagram.jpg?id=56580299&#038;width=980\" height=\"1389\" id=\"4685d\" lazy-loadable=\"true\" width=\"2223\"> <small placeholder=\"Add Photo Credit...\">            IEEE Spectrum        <\/small> <\/p>\n<p><a href=\"https:\/\/spectrum.ieee.org\/tag\/tsmc\">TSMC<\/a> and <a href=\"https:\/\/spectrum.ieee.org\/tag\/intel\">Intel<\/a> have begun manufacturing new types of transistors, called <a href=\"https:\/\/spectrum.ieee.org\/the-nanosheet-transistor-is-the-next-and-maybe-last-step-in-moores-law\" target=\"_blank\">nanosheets or gate-all-around<\/a>. We got the first look at what this means for shrinking the next generation of <a href=\"https:\/\/spectrum.ieee.org\/tag\/logic-chips\">logic chips<\/a> when <a href=\"https:\/\/spectrum.ieee.org\/sram-intel-tsmc\" target=\"_blank\">both companies reported details of SRAM memory for such new chips<\/a>. Amazingly, both companies produced memory cells exactly as small as each other right down to the nanometer. Even more amazingly, <a href=\"https:\/\/spectrum.ieee.org\/tag\/synopsys\">Synopsys<\/a> designed a cell using the previous generation of transistors that hit that density as well, but they didn\u2019t perform nearly as well.<\/p>\n<h2>8. <a href=\"https:\/\/spectrum.ieee.org\/the-long-strange-trip-from-silica-to-smartphone\" target=\"_self\">The Long Strange Trip from Silica to Smartphone<\/a><\/h2>\n<p data-rm-resized-container=\"25%\" rel=\"float: left;\"> <img loading=\"lazy\" decoding=\"async\" alt=\"Silicon wafer with layers stacked in detail, highlighting texture and layering process.\" data-rm-shortcode-id=\"695fb4d8d434be271484b4c6c3e2a030\" data-rm-shortcode-name=\"rebelmouse-image\" src=\"https:\/\/spectrum.ieee.org\/media-library\/silicon-wafer-with-layers-stacked-in-detail-highlighting-texture-and-layering-process.png?id=61622785&#038;width=980\" height=\"792\" id=\"7495d\" lazy-loadable=\"true\" width=\"1067\"> <small placeholder=\"add photo credit...\">Optics Lab<\/small><\/p>\n<p>My personal favorite of the year was a story I did myself as part of <a href=\"https:\/\/spectrum.ieee.org\/special-reports\/scale\/\" target=\"_self\">The Scale Issue<\/a>, our October <a href=\"https:\/\/spectrum.ieee.org\/tag\/special-report\">special report<\/a> exploring all kinds of scale in technology. I was assigned an article with a truly global scale\u2014<a href=\"https:\/\/spectrum.ieee.org\/the-long-strange-trip-from-silica-to-smartphone\" target=\"_blank\">tracing the 30,000-kilometer journey<\/a> from <a href=\"https:\/\/spectrum.ieee.org\/tag\/quartz\">quartz<\/a> mine through silicon ingot to smartphone.<\/p>\n<\/div>\n<p> Samuel K. Moore<br \/><a href=\"https:\/\/spectrum.ieee.org\/top-semiconductor-stories-2025\" class=\"button purchase\" rel=\"nofollow noopener\" target=\"_blank\">Read More<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>This year\u2019s top semiconductor stories were mostly about the long and twisting trips a technology takes from idea (or even raw material) to commercial deployment. I\u2019ve been at IEEE Spectrum long enough to have seen some of the early days of things that became commercial only this year. In chipmaking, that includes the production of<\/p>\n","protected":false},"author":1,"featured_media":886580,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[36992,4004],"tags":[48539,8857],"class_list":{"0":"post-886579","1":"post","2":"type-post","3":"status-publish","4":"format-standard","5":"has-post-thumbnail","7":"category-semiconductor","8":"category-stories","9":"tag-semiconductor","10":"tag-stories"},"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/newsycanuse.com\/index.php\/wp-json\/wp\/v2\/posts\/886579","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/newsycanuse.com\/index.php\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/newsycanuse.com\/index.php\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/newsycanuse.com\/index.php\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/newsycanuse.com\/index.php\/wp-json\/wp\/v2\/comments?post=886579"}],"version-history":[{"count":0,"href":"https:\/\/newsycanuse.com\/index.php\/wp-json\/wp\/v2\/posts\/886579\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/newsycanuse.com\/index.php\/wp-json\/wp\/v2\/media\/886580"}],"wp:attachment":[{"href":"https:\/\/newsycanuse.com\/index.php\/wp-json\/wp\/v2\/media?parent=886579"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/newsycanuse.com\/index.php\/wp-json\/wp\/v2\/categories?post=886579"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/newsycanuse.com\/index.php\/wp-json\/wp\/v2\/tags?post=886579"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}