Oppo Find X6 Pro: Leaked image reveals final design with huge triple Hasselblad camera module

An alleged Find X6 Pro has been spotted on Weibo, possibly a few weeks before the device’s introduction in China. While the design shown matches earlier leaks, it appears that its camera housing takes up more space than had been assumed. Regardless, the Find X6 Pro has a significantly larger camera housing than the Find X5 Pro, despite retaining three rear-facing cameras.

Reputedly, the Find X6 Pro will ship with different cameras, depending on the model chosen. Based on earlier leaks, the MediaTek Dimensity 9200-powered edition will feature three Sony IMX890 CMOS sensors, which will be capable of capturing 50 MP images each. By contrast, the Snapdragon 8 Gen 2-powered version will is rumoured to utilise the Sony IMX989 from the Xiaomi 12S Ultra and Xiaomi 13 Pro as its primary camera, plus IMX890 sensors for its ultra-wide-angle and telephoto cameras like its MediaTek-backed sibling.

The image also reveals that Oppo will continue its partnership with Hasselblad for the Find X6 series. The extent of that partnership over the Find X6 Pro remains to be seen; the Find X5 Pro and OnePlus 10 Pro mainly utilised Hasselblad tunings for camera modes and UI tweaks. Moreover, the Find X6 Pro will contain another MariSilicon chipset, Oppo’s in-house image signal processor (ISP). As it stands, Oppo is expected to partner the handset with the MariSilicon X2, rather than the existing MariSilicon X.

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Alex Alderson – Senior Tech Writer – 7305 articles published on Notebookcheck since 2018

Prior to writing and translating for Notebookcheck, I worked for various companies including Apple and Neowin. I have a BA in International History and Politics from the University of Leeds, which I have since converted to a Law Degree. Happy to chat on Twitter or Notebookchat.